Parts/Memory/HBM2E
Memory · HBM2E · 2020
HBM2E
Used in MI250X, A100 and the Ponte Vecchio stacks.
Why this part
The generation that put memory bandwidth ahead of memory capacity as the binding constraint on accelerator design. HBM2E stacks eight DRAM dies on a silicon interposer beside the compute die, in place of DIMMs on a board, trading a socket's worth of expansion for bandwidth no off-package memory can match. MI250X, A100 and the Ponte Vecchio tiles all used it, and it is the generation where "how much HBM does this part have" became a question every procurement had to ask before asking about compute throughput at all.
Systems using this part
No systems in the current dataset record this part. It is carried in the taxonomy so the graph is complete, and so edges can attach to it as coverage grows.