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Parts/Cooling/Cray-2 Fluorinert immersion cooling

Cooling · Cray-2 · 1985

Cray-2 Fluorinert immersion cooling

Circuit board stacks fully immersed in Fluorinert dielectric coolant, pumped past the boards and heat-exchanged externally; the densest board packaging of its era, and the source of the machine's 'Bubbles' nickname.

Why this part

Cray-2 could not be air-cooled at all: total immersion was a requirement of the packaging density, not an efficiency choice, and it predates the industry's return to liquid cooling by roughly two decades.

Systems using this part

Systems
1
Rmax underneath
0.0 GFlop/s
Units recorded
-
0 of 1 edges disclose a quantity
System Role Country Units System Rmax Supplied by Rank
Cray-2
1985-05
Cooling USA - - Cray
now Hewlett Packard Enterprise
-

“Units recorded” sums only the edges where a public source states a quantity. It is a floor, not a total, and should never be read as installed base.

Further reading